Day: September 25, 2025

@dubowy_alex @AlDavoodi @ThomasLeurs1 @Michael_Leh https://t.co/h7S6gg7iP3

— Disfosgen (@Disfosgen) September 25, 2025

BOAC wafer与CUP wafer有哪些区别Circuit under pad (CUP) ( bond over active circuitry (BOAC)).都是指PAD下有，现在铜 (Cu)线取代金 (Au)，降低成本。衬垫裂纹是开发过程中主要关注的问题，因为裂纹会机械地削弱

BOAC,是一种焊垫设于有源电路上方焊接的集成电路结构，也叫“有源电路上凸点”。 下面的英文段落供参考。 A BOAC/COA of a semiconductor device is manufactured by forming a conductive pad over a semiconductor device, forming a passivation oxide film over the semiconductor device including the conductive pad, forming an oxide film over the entire surface of …

🇦🇲A 15% Cut in Defense Funding

The Armenian government has reduced #defense spending by 15%.

It is worth noting that the allocation for 2026 is still $250 million higher than in 2024 and above all previous years.#Armenia #SouthCaucasus pic.twitter.com/PiWEzjTHfx

— Arthur Maghakian (@ArMaghak) September 25, 2025

Das ist so bitter… @SouthCaucasus https://t.co/3JYAZnlXnP

— Disfosgen (@Disfosgen) September 25, 2025

Bosch Ltd. is reportedly preparing for “massive” layoffs as part of a strategic move to reduce costs, according to a report by Handelsblatt on Thursday citing insider sources, Azernews reports, citing foreign media.