BOAC,是一种焊垫设于有源电路上方焊接的集成电路结构,也叫“有源电路上凸点”。 下面的英文段落供参考。 A BOAC/COA of a semiconductor device is manufactured by forming a conductive pad over a semiconductor device, forming a passivation oxide film over the semiconductor device including the conductive pad, forming an oxide film over the entire surface of …
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